Scholarships for students majoring in Engineering.
Independent Colleges of Washington Scholarships
Sponsor: Independent Colleges of Washington
Amount: Varies
Closing Date: April 17, 2026
Description: Scholarships are open to current undergraduate students who are attending a Washington Independent College. In addition to general scholarships, there are specific scholarships open to Business, STEM, and History or Political Science majors.
International Bridge, Tunnel and Turnpike Association Scholarship Program
Sponsor: IBTTA Foundation
Amount: $5,000.00
Closing Date: April 20, 2026
Description: Scholarship is open to current undergraduate college students who have completed at least two full semester of undergraduate coursework at the time of application and who are pursing a degree in one of the following fields: Civil Engineering, City and Regional Planning, Construction Management, Public Policy or Public Administration, Structural Engineering, Finance, Accounting, Information Technology, Business Management, Marketing, Communications, or Operations Management.
Liu Fang Memorial Scholarship
Sponsor: Liu Fang Memorial Foundation
Amount: $1,500.00
Closing Date: April 24, 2026
Description: Scholarship is open to women who are incoming or current college students who are majoring in Science, Technology, Engineering, or Mathematics.
Jacobs HBCU Scholarship
Sponsor: Jacobs | TMCF
Amount: Up to $5,000
Closing Date: April 24, 2026
Description: Scholarship is open to students enrolled full-time as an undergraduate freshman, sophomore, junior, or senior at an HBCU during the 2026-2027 academic school year. Applicant must be majoring in one of the following majors: Architectural Engineering, Architecture, Chemical Engineering, Civil Engineering, Construction Engineering, Construction Management, Electrical Engineering, Environmental Engineering, Environmental Health and Safety, Environmental Science, Geology, Geological Engineering, Industrial Engineering, Mechanical Engineering, Structural Engineering, Supply Chain Management, Transportation Engineering, and/or Urban Planning.
NRG HBCU Excellence in Education Scholarship
Sponsor: NRG
Amount: Up to $10,000
Closing Date: April 24, 2026
Description: Scholarship is open to students enrolled full-time as an undergraduate junior or senior during the 2026-2027 academic year at a specific TMCF school (see website for details). Applicant must be majoring in STEM, Marketing, Communications, Business, Finance, Accounting, or legal.
Sprott Inc. HBCU Scholarship
Sponsor: Sprott Inc.
Amount: $8,500.00
Closing Date: April 24, 2026
Description: Scholarship is open to incoming and current undergraduate and graduate students at HBCUs who are/will be majoring in STEM (Science, Technology, Engineering, or Math), or Finance. Applicant must have at least a 3.0 GPA.
Verisk Scholarship
Sponsor: Verisk
Amount: Up to $10,625
Closing Date: April 24, 2026
Description: Scholarship is open to students enrolled full-time as a junior or senior at a TMCF member-school during the 2026-2027 academic school year. Majoring in one of the following STEM related majors: Business, Data Science, Actuarial Science, Finance, Accounting, Mathematics, Statistics, Cyber Security, Software Engineering, Computer/Systems Engineering, Computer Science, Marketing, Programming.
AISES A. T. Anderson Memorial Scholarship
Sponsor: American Indian Science and Engineering Society
Amount: Up to $2,000
Closing Date: April 30, 2026
Description: Scholarship is open to incoming and current undergraduate and graduate students who are Native American, Alaskan Native, or Native Hawaiian. Applicant must be pursuing a degree in Mathematics, Medical Science, Physical Sciences, Technology, Science, Engineering, or Natural Resources.
American Ground Water Trust Annual Scholarships
Sponsor: American Ground Water Trust
Amount: Up to $2,000
Closing Date: April 30, 2026
Description: Scholarships are open to high school seniors who are intending to pursue a career in a ground water related field.
ARDC Scholarship
Sponsor: Amateur Radio Digital Communications (ARDC) | American Indian Science and Engineering Society
Amount: $5,000.00
Closing Date: April 30, 2026
Description: Scholarship is open to undergraduate and graduate students who are Native American, Alaskan Native, or Native Hawaiian. Applicant must be studying electrical engineering, physics, computer science, or a closely related field.
Birmingham Member Chapter Scholarship
Sponsor: Association for Iron & Steel Technology
Amount: $2,000.00
Closing Date: April 30, 2026
Description: Scholarship is open to current AIST members or the children (natural, step, adopted, or ward) or spouse of a member in good standing, of the AIST Birmingham Member Chapter (Mississippi and Alabama). Student must be accepted in an eligible, full-time course of studying in the field of engineering with a demonstrated interest towards a career in the iron and steel industry.
Cox Enterprises Scholarship Program
Sponsor: Cox Enterprises | UNCF
Amount: Up to $5,000
Closing Date: May 1, 2026
Description: Scholarship is open to underrepresented minority students who are in good academic and personal standing at any UNCF member institution. Applicant must have at least a 2.5 GPA, and preference will be given to applicants pursuing majors in the areas of STEM.
Soprema Scholarship Program
Sponsor: Soprema
Amount: $5,000.00
Closing Date: May 1, 2026
Description: Scholarship is open to current undergraduate and graduate students pursuing a degree in architecture, engineering, construction management or a similar field.
LPA Diversity in Design Scholarship
Sponsor: LPA, Inc.
Amount: $5,000.00
Closing Date: May 7, 2026
Description: Scholarship is open to high school seniors, graduates, and current college undergraduates who live in California or Texas. Applicant must be pursuing a bachelor’s degree in one of the following majors associated with the building and design industry: Architecture, Landscape Architecture, Interior Architecture/Design, Architectural Engineering, Structural Engineering, Building Science, Civil Engineering, Electrical Engineering, Mechanical Engineering, or related degree.
AMAC Scholarship Program
Sponsor: The Airport Minority Advisory Council (AMAC) Foundation
Amount: Varies
Closing Date: May 31, 2026
Description: Scholarship is open to graduating high school seniors and current college students who are pursing careers in the aviation industry and seeking a BS or BA in Aviation, Business Administration, Accounting, Architecture, Engineering or Finance.
Technology Scholarship
Sponsor: Attorney Marketing Network
Amount: $1,000.00
Closing Date: December 15, 2026
Description: Scholarship is open to current undergraduate students who are studying computer science, mathematics, science or engineering and have at least a 3.0 GPA.
JLV College Counseling


